Lo Rho FSMD1812 Series

   

        ※ RoHS Compliant / (Lead Free) Available
 
Application: All high-density boards
Product Features: Small surface mount, Solid state
Faster time to trip than standard SMD devices
Lower resistance than standard SMD devices
Operation Current: 1.40A~3.7A
Maximum Voltage: 6VDC
Temperature Range: -40°C to 85°C
Agency Recognition: *UL (E211981),
*C_UL (E211981),
*TÜV (R50004084)

 
 
 

Part

Number

Hold

Current

Trip

Current

Rated

Voltage

Max.

Current

Typical

Power

Max Time to Trip

Resistance

Current

Time

RMIN

R1MAX

IH, A

IT, A

VMAX, VDC

IMAX, A

Pd, W

A

Sec

Ohms

Ohms

FSMD140RZ

1.40

3.60

6

100

1.0

8.0

3.00

0.010

0.035

FSMD190RZ

1.90

4.90

6

100

1.0

8.0

5.00

0.003

0.025

FSMD270RZ

2.70

6.20

6

100

1.0

13.5

3.00

0.003

0.023

FSMD370RZ

3.70

9.10

6

100

1.0

18.5

2.00

0.003

0.018

 
 

IH=Hold current-maximum current at which the device will not trip at 23℃still air.
IT=Trip current-minimum current at which the device will always trip at 23℃ still air.
V MAX=Maximum voltage device can withstand without damage at it rated current.(I max)
I MAX= Maximum fault current device can withstand without damage at rated voltage (Vmax).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment.
RMIN=Minimum device resistance at 23℃ prior to tripping.
R1MAX=Maximum resistance of device at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure Tin
* Note: FSMD140RZ、 FSMD270RZ、 FSMD370RZ UL, C-UL and TÜV pending

 

 

 
 

 

                          

   

 

  

Part

Number

A

B

C

D

E

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

FSMD140RZ

4.37

4.73

3.07

3.41

0.30

0.70

0.25

0.95

0.25

0.65

FSMD190RZ

4.37

4.73

3.07

3.41

0.30

0.70

0.25

0.95

0.25

0.65

FSMD270RZ

4.37

4.73

3.07

3.41

0.40

0.75

0.25

0.95

0.25

0.65

FSMD370RZ

4.37

4.73

3.07

3.41

0.40

0.75

0.25

0.95

0.25

0.65

 
 
 

 
 
 

A = FSMD140RZ

B = FSMD190RZ

C = FSMD270RZ

D = FSMD370RZ

 

 

 
 
 

P/N
 Reel/Tape

FSMD140RZ

2K

FSMD190RZ

2K

FSMD270RZ

2K

FSMD370RZ

2K

 

 

 

 

 

 

 

 

 
 
Warning:
  1. Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame.
  2. PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated.
  3. Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance.

 
 
Pad Layouts, Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD1812 device

Pad dimensions (millimeters)

Device

A

Nominal

B

Nominal

C

Nominal

All 1812 Series

3.45

1.78

3.50

 

Solder reflow

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp)

3 ℃/second max.

Preheat :

Temperature Min  (Tsmin)

Temperature Max (Tsmax)

Time (tsmin to tsmax)

 

150 ℃

200 ℃

60-180 seconds

Time maintained above:

Temperature(TL)

Time (tL)

 

217 ℃

60-150 seconds

Peak/Classification Temperature(Tp) :

260 ℃

Time within 5℃ of actual Peak :

Temperature (tp)

 

20-40 seconds

Ramp-Down Rate :

6 ℃/second max.

Time 25 ℃ to Peak Temperature :

8 minutes max.

Note 1: All temperatures refer to of the package,

measured on the package body surface.

Solder reflow

※     Due to “Lead Free” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components.

1.       Recommended max past thickness > 0.25mm.

2.       Devices can be cleaned using standard methods and aqueous solvent.

3.       Rework use standard industry practices.

4.       Storage Environment : < 30℃ / 60%RH 

Caution:

1.       If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.

2.       Devices are not designed to be wave soldered to the bottom side of the board.